Cirrus-logic CS35L03 Instrukcja Użytkownika Pobierz pdf (Strona 2)

CS35L01/03

2 DS909F1

TABLE OF CONTENTS

1. BALL DESCRIPTIONS FOR CS35L01 & CS35L03 .............................................................................. 5

2. DIGITAL BALL CONFIGURATIONS ..................................................................................................... 6

3. TYPICAL CONNECTION DIAGRAMS ................................................................................................... 7

4. CHARACTERISTICS & SPECIFICATIONS ........................................................................................... 8

5. APPLICATIONS ................................................................................................................................... 15

5.1 MODE Descriptions ....................................................................................................................... 15

5.2 Reducing the Gain with External Series Resistors ........................................................................ 16

5.3 Output Filtering with the CS35L01/03 ............................................................................................ 17

5.4 Power-Up and Power-Down .......................................................................................................... 19

5.5 Over Temperature Protection ........................................................................................................ 20

6. TYPICAL PERFORMANCE PLOTS ..................................................................................................... 21

6.1 SD Mode Typical Performance Plots ............................................................................................. 21

6.2 FSD Mode Typical Performance Plots ........................................................................................... 23

6.3 HD Mode Typical Performance Plots ............................................................................................. 25

6.4 FHD Mode Typical Performance Plots ........................................................................................... 27

7. PARAMETER DEFINITIONS ................................................................................................................ 29

8. PACKAGING AND THERMAL INFORMATION .................................................................................. 30

8.1 Package Drawings and Dimensions (Note 20) .............................................................................. 30

8.2 Recommend PCB Footprint and Routing Configuration ................................................................ 31

8.3 Package Thermal Performance ..................................................................................................... 31

9. ORDERING INFORMATION ................................................................................................................ 33

10. REVISION HISTORY .......................................................................................................................... 33

1 2 3 4 5 6 7 ... 32 33

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